RT Journal Article
SR Electronic
A1 Müller, Miroslav
A1 Tichý, Martin
A1 Šleger, Vladimír
A1 Hromasová, Monika
A1 Kolář, Viktor
T1 Research of hybrid adhesive bonds with filler based on coffee bean powder exposed to cyclic loading
JF Manufacturing Technology Journal
YR 2020
VO 20
IS 5
SP 646
OP 654
UL https://journalmt.com/artkey/mft-202005-0010.php
AB Technology of adhesive bonding belongs to prospective bonding methods. The limit of adhesive bonds is cyclic loading which usually significantly decreases the service life of adhesive bonds and causes deformation of adhesive and cohesive bonds inside of adhesives. The article deals with the research of adhesive bonds exposed to cyclic loading. The aim of research was establishing an influence of the filler based on meshed coffee beans waste added into two-component epoxy matrix for bonding. The differences of mechanical properties of adhesive bonds with filler based on meshed coffee beans waste were evaluated at static and cyclic loading with 1000 cycles at first interval loading between 5 to 30% and second interval 5% to 70% of the static shear tensile strength.